Most of the time gold nuggets that fill a man's hart with joy are a lot larger, but Johan Leijtensis very happy to see only very small gold nuggets in this case. The reason for this is simple. Although not easily recognisable the photo shows the extra wide bondpads implemented on the IPS+ chip which is supposed to lead to the first radiation hardened single chip true digital Sunsensor IBIS.
Although the European Space Agency - ESAARTES AT contract has formally finished, nothing is stopping SystematIC Design B.V. and Lens R&D B.V.from taking the next steps in proving the functionality of the preliminary design.
After the metalfix at XFab, the gilding has now been performed PacTech - Packing Technologiesand the chips will go for dicing and packaging shortly after which PhotonFirstwill create new prototypes to be tested.
Exiting times ahead and steps taken that at least at Lens R&D B.V.make people happy.
